DocumentCode
2379483
Title
Efficiency of thread-level speculation in SMT and CMP architectures - performance, power and thermal perspective
Author
Packirisamy, V. ; Luo, Yangchun ; Hung, Wei-Lung ; Zhai, Antonia ; Yew, Pen-Chung ; Ngai, Tin-Fook
Author_Institution
Univ. of Minnesota, Minneapolis, MN
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
286
Lastpage
293
Abstract
Computer industry has adopted multi-threaded and multi-core architectures as the clock rate increase stalled in early 2000psilas. However, because of the lack of compilers and other related software technologies, most of the general-purpose applications today still cannot take advantage of such architectures to improve their performance. Thread-level speculation (TLS) has been proposed as a way of using these multi-threaded architectures to parallelize general-purpose applications. Both simultaneous multithreading (SMT) and chip multiprocessors (CMP) have been extended to implement TLS. While the characteristics of SMT and CMP have been widely studied under multi-programmed and parallel workloads, their behavior under TLS workload is not well understood. The TLS workload due to speculative nature of the threads which could potentially be rollbacked and due to variable degree of parallelism available in applications, exhibits unique characteristics which makes it different from other workloads. In this paper, we present a detailed study of the performance, power consumption and thermal effect of these multithreaded architectures against that of a Superscalar with equal chip area. A wide spectrum of design choices and tradeoffs are also studied using commonly used simulation techniques. We show that the SMT based TLS architecture performs about 21% better than the best CMP based configuration while it suffers about 16% power overhead. In terms of Energy-Delay-Squared product (ED2), SMT based TLS performs about 26% better than the best CMP based TLS configuration and 11% better than the superscalar architecture. But the SMT based TLS configuration, causes more thermal stress than the CMP based TLS architectures.
Keywords
microprocessor chips; multi-threading; multiprocessing programs; parallel architectures; chip multiprocessor architecture; computer industry; multicore architecture; multiprogramming; parallel workload; power consumption; simultaneous multithread architecture; thermal effect; Application software; Clocks; Computer architecture; Computer industry; Multithreading; Parallel processing; Software performance; Surface-mount technology; Thermal stresses; Yarn;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design, 2008. ICCD 2008. IEEE International Conference on
Conference_Location
Lake Tahoe, CA
ISSN
1063-6404
Print_ISBN
978-1-4244-2657-7
Electronic_ISBN
1063-6404
Type
conf
DOI
10.1109/ICCD.2008.4751875
Filename
4751875
Link To Document