• DocumentCode
    2379648
  • Title

    Selective Epitaxial Germanium Growth on Silicon - Trench Fill and In Situ Doping

  • Author

    Huang, Yi-Chiau ; Li, Jiping ; Jin, Miao ; Wood, Bingxi ; Sanchez, Errol ; Kim, Yihwan

  • Author_Institution
    Appl. Mater., Inc., Sunnyvale, CA, USA
  • fYear
    2012
  • fDate
    4-6 June 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    This paper presented the selective epitaxial germanium growth on silicon by trench filling and doping. The process operated in a reaction rate limited regime at a low temperature (350°C to 400°C) to ensure reasonable growth rate, decent surface morphology, and high dopant incorporation in Ge.
  • Keywords
    boron; doping profiles; elemental semiconductors; epitaxial growth; germanium; phosphorus; semiconductor doping; semiconductor epitaxial layers; semiconductor growth; surface morphology; Ge:B; Ge:P; Si; in situ doping; selective epitaxial germanium growth; surface morphology; temperature 350 degC to 400 degC; trench filling; Annealing; Arrays; Conductivity; Doping; MOSFETs; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    978-1-4577-1864-9
  • Electronic_ISBN
    978-1-4577-1863-2
  • Type

    conf

  • DOI
    10.1109/ISTDM.2012.6222456
  • Filename
    6222456