Over 10 Gbps/ch compact active interposer module for high-speed and high-density chip level optical interconnects

This paper presents prototype demonstration of the fabricated active interposer module. The fabricated active interposer is composed of 32 ch transmitter and 32 ch receiver, built on a compact interposer substrate, each of them alternately arranged eight by eight channels with an optical I/O port having a pigtail ribbon fiber. The transmitter unit is comprised of a pair of 4 ch VCSEL array flip chip bonded onto a waveguide coupler of the I/O port and a pair of 4 ch driver IC mounted on the interposer substrate. The receiver unit is similarly constructed. This device has potential application to future high performance chip level optical interconnects over 10 Gbps/ch.