• DocumentCode
    2381598
  • Title

    A new tool to assess mechanical and dielectric properties of tissues

  • Author

    Guhr, G. ; Schmidt, H. ; Weihnacht, M.

  • Author_Institution
    Leibniz Inst. for Solid State & Mater. Res. Dresden, Dresden, Germany
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    729
  • Lastpage
    732
  • Abstract
    In this paper a new tool to assess viscoelastic and dielectric properties of biological samples is presented. Shear horizontal polarized surface acoustic waves (SH-SAW) are used to detect the viscoelastic properties of the extracellular matrix (ECM) expelled by adhering fibroblast cell cultures. Therefore a one-port SAW resonator, with a fundamental mode of 85 MHz was developed. Its electrode structure can be used simultaneously to detect the dielectric behavior of the whole system by impedance spectroscopy (IS) while the frequency ranges from kHz to MHz. The applicability of the combination of both methods appearing as new tool is exemplarily shown by cell adhesion experiments performed with L929 and NIH-3T3 fibroblasts.
  • Keywords
    bioelectric phenomena; biological techniques; biological tissues; biomechanics; cellular biophysics; dielectric properties; surface acoustic wave devices; surface acoustic waves; viscoelasticity; L929 fibroblasts; NIH-3T3 fibroblasts; biological tissue dielectric properties; biological tissue mechanical properties; biological tissue viscoelastic properties; extracellular matrix; fibroblast cell adhesion; frequency 85 MHz; impedance spectroscopy; one port SAW resonator; shear horizontal polarized SAW; surface acoustic waves; Acoustics; Animals; Cell Line; Elastic Modulus; Electric Conductivity; Equipment Design; Equipment Failure Analysis; Fibroblasts; Mice; Micro-Electrical-Mechanical Systems; Plethysmography, Impedance; Reproducibility of Results; Sensitivity and Specificity; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5332908
  • Filename
    5332908