Ceramic packaging technologies for microwave applications

Author

Salmela, Olli ; Ikäläinen, Pertti

Author_Institution

Nokia Res. Center, Espoo, Finland

fYear

1997

fDate

11-13 Aug 1997

Firstpage

162

Lastpage

164

Abstract

Laminated ceramic packaging technologies, such as high temperature cofired ceramics (HTCC) and low temperature cofired ceramics (LTCC), are a low-cost alternative for metallic packages in high reliability applications in the microwave frequency region. As in metallic packages the main concern-from an electrical performance point of view-is the resonances in cavities; in ceramic packages isolation also has to be considered. Typically good isolation has been accomplished with the use of vias in strategic regions, such as around chip cavities and between neighbouring signal lines. In this paper, the key features of laminated ceramic packaging technologies are presented with some 3-D electromagnetic simulation results concerning isolation

Keywords

ceramics; integrated circuit packaging; laminates; microwave integrated circuits; thick film circuits; 3-D electromagnetic simulation; cavities; ceramic packaging technologies; chip cavities; electrical performance; high reliability applications; high temperature cofired ceramics; laminated ceramic packaging; low temperature cofired ceramics; metallic packages; microwave applications; neighbouring signal lines; resonances; vias; Ceramics; Conducting materials; Dielectric losses; Isolation technology; Microwave frequencies; Microwave technology; Packaging; Software performance; Stripline; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless Communications Conference, 1997., Proceedings

Conference_Location

Boulder, CO

Print_ISBN

0-7803-4194-5

Type

conf

DOI

10.1109/WCC.1997.622270

Filename

622270