• DocumentCode
    2381926
  • Title

    Generalized formulas to express maximum temperature difference for two-stage thermoelectric cooling modules

  • Author

    Hyun, Dow-Bin ; Kolomoets, N.V. ; Oh, Tae-Sung ; Hwang, Jong-Seung ; Jae-Dong Shim

  • Author_Institution
    Div. of Metals, Korea Inst. of Sci. & Technol., Seoul, South Korea
  • fYear
    1997
  • fDate
    26-29 Aug 1997
  • Firstpage
    679
  • Lastpage
    682
  • Abstract
    Application of the two-stage modules has been widely considered to obtain a large temperature difference, required for devices such as a freezer, by thermoelectric cooling. Due to the complexity of the formulas for maximum parameters, however, design of the application devices in practical use has been limited. Generalized formulas have been derived to express the maximum temperature difference and maximum current at ΔTmax-mode for two-stage thermoelectric modules connected electrically in series or in parallel: ΔTmax=Tk(a/c)(M´-1/M´+1), Imax=2T h(a/b)(e1/R1)(1/M´+1), and M´=(1+2Tk(ac/b)((Z1)/(K2/K1 )))1/2. Corresponding to these expressions, ΔT max=Th-(M´-1)/(Z1)=Th (M´-1)/(M´+1), Imax=(K1)/(e1)(M´-1)=2Th(e 1)/(R1)(1)/(M´+1), and M´=(1+2·Z1·Tk)1/2 for one-stage modules
  • Keywords
    Seebeck effect; cooling; modules; refrigeration; temperature distribution; thermoelectric conversion; thermoelectric devices; Seebeck coefficient; cascade module; generalized formulas; maximum current; maximum temperature difference; parallel connected; series connected; thermal conductance; two-stage thermoelectric cooling modules; Cooling; Difference equations; Electric resistance; Electronic mail; Materials science and technology; Temperature; Thermal conductivity; Thermal resistance; Thermoelectric devices; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
  • Conference_Location
    Dresden
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4057-4
  • Type

    conf

  • DOI
    10.1109/ICT.1997.667621
  • Filename
    667621