Integrated heat sink-heat pipe thermal cooling device

Author

Yusuf, I. ; Watwe, A. ; Ekhlassi, H.

Author_Institution

Design Process Dev., Assembly Technol. Dev., Chandler, AZ, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

27

Abstract

This paper discusses the design and manufacturability of an optimal thermal cooling solution for microelectronic chips and packages comprised of the integration of folded fin heat sink and heat pipe technologies. This cooling solution is shown to provide a heat-sink-to-ambient thermal resistance of 0.2°C/W. Current extruded heat sink technology being used for the Pentium II generation of microprocessors provides a heat-sink-to-ambient thermal resistance of 0.7-0.8°C/W. Thus the integration of the folded fins to a vapor chamber base provides nearly a 4× improvement on previous HVM enabled heat sinks. The optimization of this thermal cooling solution to yield a robust, cost effective design by leveraging high volume manufacturing (HVM) technologies is described in this paper

Keywords

cooling; electronic equipment manufacture; heat pipes; heat sinks; integrated circuit packaging; thermal management (packaging); thermal resistance; cost effective design; folded fin heat sink technology; heat pipe technology; high volume manufacturing technologies; integrated heat sink-heat pipe device; manufacturability; microelectronic chips; microelectronic packages; thermal cooling device; thermal resistance; vapor chamber base; Cooling; Cost function; Design optimization; Heat sinks; Microelectronics; Microprocessors; Packaging; Pulp manufacturing; Robustness; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866166

Filename

866166