DocumentCode :
2382473
Title :
A computational model for the transient analysis of flat heat pipes
Author :
Sobhan, C.B. ; Garimella, S.V. ; Unnikrishnan, V.V.
Author_Institution :
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
2
fYear :
2000
fDate :
2000
Firstpage :
106
Abstract :
A computational model is developed for the analysis of the transient operation of a flat heat pipe. The analysis involves the solution of the two-dimensional continuity, momentum and energy equations coupled with the state equation in the vapor core, the transport equations for a porous medium in the wick, and the two-dimensional heat conduction equation in the heat pipe wall. The equations are discretized and solved using a finite-difference approach. Variations in the temperature, pressure and velocity fields are obtained as a function of time. The effect of the axial conduction through the heat pipe wall and wick, which causes heat to flow into the interior in the externally adiabatic section, thus affecting the velocity distributions in the wick and vapor, is brought out in the present analysis. The heat removal capability of the heat pipe is contrasted to that of a solid copper block of the same overall dimensions as the heat pipe, and a copper plate with dimensions equivalent to those of the heat pipe wall
Keywords :
cooling; finite difference methods; heat conduction; heat pipes; modelling; pressure; temperature distribution; thermal analysis; thermal management (packaging); transient analysis; velocity; 2D continuity equation; 2D energy equation; 2D finite-difference model; 2D heat conduction equation; 2D momentum equation; axial conduction; computational model; externally adiabatic section; flat heat pipes; heat flow; heat pipe wall; heat removal capability; porous medium; pressure field variations; temperature field variations; transient analysis; transient operation; transport equations; vapour core state equation; velocity field variations; wick; Computational modeling; Copper; Equations; Heat engines; Heat transfer; Solids; Temperature; Thermal conductivity; Thermal management of electronics; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1089-9870
Print_ISBN :
0-7803-5912-7
Type :
conf
DOI :
10.1109/ITHERM.2000.866178
Filename :
866178
Link To Document :
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