High heat flux heat pipe mechanism for cooling of electronics

Author

Zuo, Z.J. ; North, M.T. ; Wert, K.L.

Author_Institution

Thermacore Inc., Lancaster, PA, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

122

Abstract

This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm². The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and is solved to predict the heat pipe´s thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment

Keywords

cooling; heat pipes; hydrodynamics; numerical analysis; thermal analysis; thermal management (packaging); two-phase flow; electronic equipment cooling; heat dissipation densities; heat pipe design; heat transfer coefficient; high heat flux heat pipe mechanism; hydrodynamic model; numerical model; thermal performance prediction; thermally driven pulsating two-phase flow; wick structure; Electronic packaging thermal management; Electronics cooling; Heat pumps; Heat sinks; Heat transfer; Powders; Thermal conductivity; Thermal stresses; USA Councils; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866180

Filename

866180