A novel method of cooling electronic packages using a porous channel heat sink subjected to oscillating flow

Author

Fu, H.L. ; Leong, K.C. ; Huang, X.Y. ; Liu, C.Y.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

Volume

2

fYear

2000

fDate

2000

Firstpage

162

Abstract

In this paper, a novel method of cooling electronic components using a porous channel heat sink has been developed. Experiments have been conducted to study the heat transfer of the porous channel heat sink subjected to oscillating flow. The surface temperature distributions for both steady and oscillating flows were measured. The local and length-averaged Nusselt numbers were measured and analyzed. The experimental results revealed that the surface temperature distribution for oscillating flow is more uniform than that for steady flow. Due to the reversing flow direction, there are two thermal entrance regions for oscillating flow. The length-averaged Nusselt number for oscillating flow is much higher than that for steady flow. The porous channel heat sink subjected to oscillating flow can be considered as an effective method for cooling high-speed electronic devices

Keywords

channel flow; cooling; flow through porous media; fluid oscillations; heat sinks; temperature distribution; thermal management (packaging); Nusselt number; cooling; electronic package; heat transfer; high-speed electronic device; oscillating flow; porous channel heat sink; surface temperature distribution; Ducts; Electronics cooling; Electronics packaging; Heat engines; Heat sinks; Heat transfer; High-speed electronics; Modems; Temperature distribution; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866186

Filename

866186