DocumentCode :
2382666
Title :
The developing role for nonlinear control design in oxide growth during rapid isothermal processing
Author :
Burg, T. ; Dawson, D. ; Vedagarbha, P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
fYear :
1996
fDate :
15-18 Sep 1996
Firstpage :
840
Lastpage :
845
Abstract :
This paper presents the preliminary development of a nonlinear controller to regulate the growth of oxide on silicon in a Rapid Isothermal Processing (RIP) system. The objective is to address one of the issues faced by the US silicon IC industry in manufacturing microelectronic structures with low power consumption, high-speed reduced size, and built-in reliability. The control design begins with a description of the dynamic growth process, this description provides a general nonlinear functional relationship between the properties of the silica, i.e., oxide thickness and compressive stress, and the control inputs, lamp power and gas flow. Based on this generic process model, the integrator backstepping approach is used to design a nonlinear, full-state feedback process controller. Included in the paper is a discussion of the use of Raman Spectroscopy as a means of measuring temperature, oxide thickness, and oxide stress during the growth process
Keywords :
elemental semiconductors; nonlinear control systems; oxidation; process control; rapid thermal processing; semiconductor technology; silicon; Raman spectroscopy; Si; SiO2; compressive stress; dynamic process; integrator backstepping; microelectronic structure; nonlinear full-state feedback process controller; oxide growth; rapid isothermal processing; silica; silicon IC manufacturing; temperature measurement; thickness; Control design; Control systems; Electrical equipment industry; High speed integrated circuits; Industrial relations; Isothermal processes; Manufacturing industries; Microelectronics; Nonlinear control systems; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Control Applications, 1996., Proceedings of the 1996 IEEE International Conference on
Conference_Location :
Dearborn, MI
Print_ISBN :
0-7803-2975-9
Type :
conf
DOI :
10.1109/CCA.1996.558976
Filename :
558976
Link To Document :
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