• DocumentCode
    2382986
  • Title

    An experimental and numerical investigation of pressure drop in a closed loop two phase thermosyphon system

  • Author

    Khodabandeh, Rahmatollah ; Palm, Bjöirn

  • Author_Institution
    Div. of Energy Technol., R. Inst. of Technol., Stockholm, Sweden
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    333
  • Abstract
    The increase of heat fluxes from electronic components requires new methods of cooling of electronics. One efficient method of cooling is to use a closed loop two-phase thermosyphon system. The advantage of these systems is that extremely high heat fluxes can be dissipated at a low temperature difference due to the high heat transfer coefficients in boiling and condensation. In this paper experimental results of the pressure drop in the evaporator, riser and condenser of an advanced closed loop thermosyphon and numerical calculations of the pressure drop in the thermosyphon system, based on correlations from the literature, are presented. The thermosyphon system consists of a downcomer, an evaporator, a riser and a condenser. Heat was supplied by a power resistor and tests were performed with the heat loads 30, 60 and 90 W dissipated through the system. Two different refrigerants were tested, R134a and R600a. Pressure drop was measured across each of the four basic components by a differential pressure transducer. Comparisons between the experimental and numerical results are presented
  • Keywords
    condensation; cooling; numerical analysis; pressure; thermal management (packaging); R134a; R600a; boiling; closed loop two phase thermosyphon system; condensation; condenser; cooling; differential pressure transducer; downcomer; electronic components; evaporator; heat flux; heat transfer coefficients; numerical investigation; pressure drop; refrigerants; riser; Electronic components; Electronics cooling; Heat transfer; Performance evaluation; Power supplies; Pressure measurement; Refrigerants; Resistors; System testing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866211
  • Filename
    866211