DocumentCode
2383372
Title
Thermal conductivity of thin films-experimental methods and theoretical interpretation
Author
Völklein, Friedemann ; Starz, T.
Author_Institution
Fac. of Phys. Technol., FH Wiesbaden, Russelsheim, Germany
fYear
1997
fDate
26-29 Aug 1997
Firstpage
711
Lastpage
718
Abstract
The determination of the thermal conductivity of thin films is of great interest both for understanding the structure and conduction mechanism and for numerous technical applications of these films. The thermal conductivity λ is a crucial term of the thermoelectric figure of merit z=α2σ/λ and consequently an important parameter for the design of thermoelectric thin film devices. Usually the film properties differ considerably from the bulk. Recently research activities are focused on thermoelectric thin film materials, since high z values can be expected in low-dimensional structures. Standard methods for the investigation of the Seebeck coefficient α and the electrical conductivity σ are well established. However, measurements of the thermal conductivity of thin films are sophisticated and associated with various problems. New methods for the measurement of the thermal conductivity of thin films are reviewed. The problems of stationary and transient measuring techniques are discussed. The results are interpreted with models of surface scattering and grain boundary scattering of charge carriers and phonons
Keywords
electron-phonon interactions; metallic thin films; phonon-phonon interactions; semimetallic thin films; surface scattering; thermal conductivity; thermal conductivity measurement; thin films; 3ω method; bipolar semimetal films; charge carriers; conduction mechanism; grain boundary scattering; lattice conductivity; low-dimensional structures; measurement methods; models; phonons; polycrystalline metal films; stationary measuring techniques; surface scattering; thermal conductivity; thermoelectric figure of merit; thermoelectric thin film devices design; thin films; time response analysis; transient measuring techniques; Conducting materials; Conductive films; Conductivity measurement; Grain boundaries; Scattering; Thermal conductivity; Thermoelectric devices; Thermoelectricity; Thin film devices; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1997. Proceedings ICT '97. XVI International Conference on
Conference_Location
Dresden
ISSN
1094-2734
Print_ISBN
0-7803-4057-4
Type
conf
DOI
10.1109/ICT.1997.667630
Filename
667630
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