DocumentCode
2383387
Title
Advanced SPICE modeling of large power IGBT modules
Author
Azar, R. ; Udrea, F. ; De Silva, M. ; Amaratunga, G. ; Ng, W.T. ; Dawson, F. ; Findlay, W. ; Waind, P.
Author_Institution
Dept. of Eng., Cambridge Univ., UK
Volume
4
fYear
2002
fDate
13-18 Oct. 2002
Firstpage
2433
Abstract
An enhanced IGBT model based on the Kraus model with new derivations based on an extra parameter accounting for p-i-n injection was developed to allow simulation of both trench and DMOS IGBT structures. Temperature dependence was also implemented in the model. The model was validated against steady state and transient measurements done on an 800 A, 1.7 kV Dynex IGBT module at 25/spl deg/C and 125/spl deg/C. The Spice model has also shown excellent agreement with mixed mode MEDICI simulations. The Spice model also takes into account for the first time the parasitic thyristor effect allowing the DC and dynamic temperature dependent latchup modeling of power modules as well as their temperature dependent safe operating area.
Keywords
SPICE; digital simulation; insulated gate bipolar transistors; modules; semiconductor device measurement; semiconductor device models; 1.7 kV; 125 C; 25 C; 800 A; DC modeling; DMOS IGBT structures; Dynex IGBT module; Kraus model; SPICE modeling; dynamic temperature dependent latchup modeling; large power IGBT modules; mixed mode MEDICI simulations; p-i-n injection; parasitic thyristor effect; power modules; steady state measurements; temperature dependence; temperature dependent safe operating area; transient measurements; trench IGBT structures; Cathodes; Equations; Insulated gate bipolar transistors; Medical simulation; PIN photodiodes; Power engineering and energy; SPICE; Steady-state; Temperature dependence; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 2002. 37th IAS Annual Meeting. Conference Record of the
Conference_Location
Pittsburgh, PA, USA
ISSN
0197-2618
Print_ISBN
0-7803-7420-7
Type
conf
DOI
10.1109/IAS.2002.1042786
Filename
1042786
Link To Document