DocumentCode :
2384140
Title :
Short-circuit ruggedness of high-voltage IGBTs
Author :
Lutz, J. ; Basler, T.
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Chemnitz, Germany
fYear :
2012
fDate :
13-16 May 2012
Firstpage :
243
Lastpage :
250
Abstract :
The IGBT can run into different short-circuit types (SC I, SC II, SC III). Especially in SC II and III, an interaction between the gate drive unit and the IGBT takes place. A self-turn-off mechanism after short-circuit turn on can occur. Parasitic elements in the connection between the IGBT and the gate unit as well as asymmetrical wiring of devices connected in parallel are of effect to the short-circuit capability. In high-voltage IGBTs, filament formation can occur at short-circuit condition. Destructive measurements with its failure patterns and short-circuit protection methods are shown.
Keywords :
insulated gate bipolar transistors; SC I; SC II; SC III; asymmetrical wiring; failure patterns; filament formation; gate drive unit; high-voltage IGBT; parasitic elements; self-turn-off mechanism; short-circuit protection methods; short-circuit ruggedness; short-circuit types; Capacitance; Current measurement; Insulated gate bipolar transistors; Logic gates; Resistors; Semiconductor device measurement; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics (MIEL), 2012 28th International Conference on
Conference_Location :
Nis
ISSN :
pending
Print_ISBN :
978-1-4673-0237-1
Type :
conf
DOI :
10.1109/MIEL.2012.6222845
Filename :
6222845
Link To Document :
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