• DocumentCode
    2384140
  • Title

    Short-circuit ruggedness of high-voltage IGBTs

  • Author

    Lutz, J. ; Basler, T.

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2012
  • fDate
    13-16 May 2012
  • Firstpage
    243
  • Lastpage
    250
  • Abstract
    The IGBT can run into different short-circuit types (SC I, SC II, SC III). Especially in SC II and III, an interaction between the gate drive unit and the IGBT takes place. A self-turn-off mechanism after short-circuit turn on can occur. Parasitic elements in the connection between the IGBT and the gate unit as well as asymmetrical wiring of devices connected in parallel are of effect to the short-circuit capability. In high-voltage IGBTs, filament formation can occur at short-circuit condition. Destructive measurements with its failure patterns and short-circuit protection methods are shown.
  • Keywords
    insulated gate bipolar transistors; SC I; SC II; SC III; asymmetrical wiring; failure patterns; filament formation; gate drive unit; high-voltage IGBT; parasitic elements; self-turn-off mechanism; short-circuit protection methods; short-circuit ruggedness; short-circuit types; Capacitance; Current measurement; Insulated gate bipolar transistors; Logic gates; Resistors; Semiconductor device measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (MIEL), 2012 28th International Conference on
  • Conference_Location
    Nis
  • ISSN
    pending
  • Print_ISBN
    978-1-4673-0237-1
  • Type

    conf

  • DOI
    10.1109/MIEL.2012.6222845
  • Filename
    6222845