DocumentCode :
2384185
Title :
Power transistor models with temperature dependent parasitic effects for SPICE-like circuit simulation
Author :
Chvála, A. ; Donoval, D. ; Marek, J. ; Príbytný, P. ; Molnár, M.
Author_Institution :
Inst. of Electron. & Photonics, Slovak Univ. of Technol., Bratislava, Slovakia
fYear :
2012
fDate :
13-16 May 2012
Firstpage :
255
Lastpage :
258
Abstract :
New SPICE-like simulation models for a power MOSFET containing a dynamic link between electrical and thermal component descriptions were described. The designed electro-thermal MOSFET model consists of several parts which represent different transistor behavior at different conditions as reverse bias, avalanche breakdown, thermal burning and others. Modified thermal equivalent circuit diagrams were designed taking into account thermal dependence of thermal resistivity. The possibilities and limitations of the new models are analyzed and presented. An unclamped inductive switching (UIS) test was used for comparison and verification of proper behavior of designed MOSFET model.
Keywords :
SPICE; circuit simulation; equivalent circuits; power MOSFET; semiconductor device models; semiconductor device testing; thermal conductivity; SPICE-like circuit simulation model; UIS test; avalanche breakdown; dynamic link; electrical component descriptions; electrothermal MOSFET model; modified thermal equivalent circuit diagrams; power MOSFET; power transistor models; reverse bias; temperature dependent parasitic effects; thermal burning; thermal component descriptions; thermal resistivity; unclamped inductive switching test; Integrated circuit modeling; MOSFET circuits; Resistors; Temperature dependence; Temperature measurement; Thermal resistance; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics (MIEL), 2012 28th International Conference on
Conference_Location :
Nis
ISSN :
pending
Print_ISBN :
978-1-4673-0237-1
Type :
conf
DOI :
10.1109/MIEL.2012.6222847
Filename :
6222847
Link To Document :
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