DocumentCode
2384562
Title
Charge trapping at low injection currents in (TiN, Mo, Pt)/Ta2 O5 :Hf/SiO2 /Si structures
Author
Georgievska, L.S. ; Novkovski, N. ; Atanassova, E.
Author_Institution
Inst. of Math. & Phys., Univ. St Cyril & Methodius, Skopje, Macedonia
fYear
2012
fDate
13-16 May 2012
Firstpage
331
Lastpage
334
Abstract
Samples investigated in this work contain Hf-doped layers of Ta2O5, i.e. the mixture of two most favorable high-k materials, which proved appropriate characteristics for application in DRAMs and MOSFETs. The influence of the top electrode material, with different work functions, on the electrical properties of MIS structures is of particular interest and was studied in this work. Here we confirmed that the presence of interface states causes frequency dispersion of C-V characteristics, but still the negligible hysteresis indicates very low slow states density of the order of 1010 cm-2. Another effect observed here is due to the nature of the gate electrodes. It is observed only in the case of high-work-function metal, when trapping of charges in the emptied positive traps in doped Ta2O5 occurs, case that was previously observed in pure Ta2O5. Here we have determined the parameters of the traps responsible for this effect.
Keywords
DRAM chips; MOSFET; electron traps; hafnium; molybdenum; platinum; silicon compounds; tantalum compounds; titanium compounds; C-V characteristics; DRAM; MIS structures; MOSFET; Mo-Ta2O5:Hf-SiO2-Si; Pt-Ta2O5:Hf-SiO2-Si; TiN-Ta2O5:Hf-SiO2-Si; charge trapping; electrical properties; electrode material; frequency dispersion; high-k materials; high-work-function metal; interface states; low injection currents; positive traps; very low slow states density; Capacitance; Capacitance-voltage characteristics; Charge carrier processes; Electrodes; High K dielectric materials; Logic gates; Metals;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics (MIEL), 2012 28th International Conference on
Conference_Location
Nis
ISSN
pending
Print_ISBN
978-1-4673-0237-1
Type
conf
DOI
10.1109/MIEL.2012.6222867
Filename
6222867
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