• DocumentCode
    2384843
  • Title

    A configurable IC for wireless real-time in vivo monitoring of chemical and electrical neural activity

  • Author

    Roham, Masoud ; Blaha, Charles D. ; Garris, Paul A. ; Lee, Kendall H. ; Mohseni, Pedram

  • Author_Institution
    Electr. Eng. & Comput. Sci. Dept, Case Western Reserve Univ., Cleveland, OH, USA
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    4222
  • Lastpage
    4225
  • Abstract
    A 16-channel chip for wireless in vivo recording of chemical and electrical neural activity is described. The 7.83-mm2 IC is fabricated using a 0.5-mum CMOS process and incorporates a 71-muW, 3rd-order, configurable, DeltaSigma modulator per channel, achieving an input-referred noise of 4.69 muVrms in 4-kHz BW and 94.1 pArms in 5-kHz BW for electrical and fast-scan voltammetric chemical neurosensing, respectively. Brain extracellular levels of dopamine elicited by electrical stimulation of the medial forebrain bundle have been recorded wirelessly on multiple channels using 300-V/s fast-scan cyclic voltammetry in the anesthetized rat.
  • Keywords
    CMOS integrated circuits; biochemistry; bioelectric phenomena; biomedical electronics; biomedical measurement; delta-sigma modulation; medical signal processing; neurophysiology; voltammetry (chemical analysis); CMOS technology; DeltaSigma modulator; anesthetized rat; brain extracellular dopamine level; chemical neural activity; configurable IC; electrical neural activity; electrical stimulation; fast-scan voltammetric chemical neurosensing; input-referred noise; medial forebrain bundle; wireless real-time in vivo monitoring; Animals; Computer Communication Networks; Electronics; Electrophysiology; Equipment Design; Male; Microelectrodes; Models, Neurological; Monitoring, Ambulatory; Nerve Net; Rats; Telemetry; Time Factors; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333089
  • Filename
    5333089