Title :
Skinny trace compensation methodology for high speed serial interface
Author :
Mi, Minhong ; Taliaferro, Steve ; Murugan, Rajen ; De Araujo, Daniel
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
Skinny trace compensation is a simple yet effective technique for overcoming capacitive impedance discontinuities on high speed channels. This paper provides a comprehensive system-level modeling and analysis methodology for implementing this technique on high speed serial interface. System level simulation correlation to laboratory measurement for the HDMI (High Definition Multimedia Interface) interface on a real high speed low power mobile microprocessor SOC (System on Chip) design is presented.
Keywords :
compensation; microprocessor chips; system-on-chip; HDMI; capacitive impedance discontinuity; comprehensive system-level modeling; high definition multimedia interface; high speed channel; high speed serial interface; laboratory measurement; low power mobile microprocessor SOC design; low power mobile microprocessor system on chip design; skinny trace compensation methodology; system level simulation correlation; Abstracts; Loading;
Conference_Titel :
Signal and Power Integrity (SPI), 2012 IEEE 16th Workshop on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4673-1503-6
DOI :
10.1109/SaPIW.2012.6222900