Author :
Lin, Jason C H ; Yeh, T.H. ; Lee, C.Y. ; Chen, C.H. ; Tsay, J.L. ; Chen, S.H. ; Hsu, H.M. ; Chen, C.W. ; Huang, C.F. ; Chiang, J.M. ; Chang, Allan ; Chang, R.Y. ; Chang, C.L. ; Wang, S.H. ; Wu, C.C. ; Lin, C.Y. ; Chu, Y.L. ; Chen, S.M. ; Hsu, C.K. ; Liou,
Abstract :
We present an overview of the state-of-the-art RF/Analog foundry technology as well as future trends and roadmap. This set of RF/analog technology is built on top of cutting-edge logic technology platforms and it enables cost-effective and fast-time-to-market/volume system-on-chip (SoC) applications, including the rapidly growing wireless-LAN (WLAN) and Blue tooth products in addition to traditional consumer and communication products. Results from 0.18 μm- to 0.13 μm-generation mixed-signal and RF CMOS technology, and SiGe BiCMOS technology are highlighted. Special optimization of active devices and precision high-Q components is also illustrated.
Keywords :
BiCMOS integrated circuits; Bluetooth; CMOS integrated circuits; Q-factor; mixed analogue-digital integrated circuits; system-on-chip; wireless LAN; 0.18 to 0.13 micron; Blue tooth products; RF CMOS technology; RF/analog foundry technology; SiGe; SiGe BiCMOS technology; SoC; WLAN; active devices; cutting-edge logic technology platforms; mixed-signal technology; precision high-Q components; state-of-the-art; volume system-on-chip; wireless-LAN; BiCMOS integrated circuits; Bluetooth; CMOS logic circuits; CMOS technology; Foundries; Germanium silicon alloys; Radio frequency; Silicon germanium; System-on-a-chip; Wireless LAN;
