• DocumentCode
    2386015
  • Title

    How to Achieve High Mobility Thin Film Transistors by Direct Deposition of Silicon Using 13.56 MHz RF PECVD?

  • Author

    Lee, C.-H. ; Sazonov, A. ; Robertson, J. ; Nathan, A. ; Esmaeili-Rad, M.R. ; Servati, P. ; Milne, W.I.

  • Author_Institution
    Electr. & Comput. Eng., Waterloo Univ., Ont.
  • fYear
    2006
  • fDate
    11-13 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    CMOS nanocrystalline silicon thin film transistors with high field effect mobility are reported. The transistors were directly deposited by radio-frequency plasma enhanced chemical vapor deposition at 150 degC. The transistors show maximum field effect mobility of 450 cm2/V-s for electrons and 100 cm2/V-s for holes at room temperature. We attribute the high mobilities to a reduction of the oxygen content, which acts as an accidental donor. Indeed, secondary ion mass spectrometry measurements show that the impurity concentration in the nanocrystalline Si layer is comparable to, or lower than, the defect density in the material, which is already low thanks to hydrogen passivation
  • Keywords
    elemental semiconductors; passivation; plasma CVD; secondary ion mass spectroscopy; silicon; thin film transistors; 13.56 MHz; 150 C; CMOS nanocrystalline silicon thin film transistors; RF PECVD; Si; accidental donor; defect density; direct deposition; field effect mobility; high mobility thin film transistors; hydrogen passivation; impurity concentration; nanocrystalline Si layer; oxygen content; radio-frequency plasma enhanced chemical vapor deposition; secondary ion mass spectrometry measurements; Charge carrier processes; Chemical vapor deposition; Electron mobility; FETs; Mass spectroscopy; Plasma chemistry; Plasma temperature; Radio frequency; Silicon; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2006. IEDM '06. International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    1-4244-0439-8
  • Electronic_ISBN
    1-4244-0439-8
  • Type

    conf

  • DOI
    10.1109/IEDM.2006.346766
  • Filename
    4154185