• DocumentCode
    2386022
  • Title

    Transforming Intel factories from global presence to global operation!

  • Author

    Montoya, Robert J. ; Williams, Gary

  • Author_Institution
    Intel Corp., Rio Rancho, NM, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    17
  • Lastpage
    20
  • Abstract
    The collective output of multiple high volume factories located around the world has enabled Intel to satisfy the enormous demand requirements of customers worldwide. The global operation concept transforms this cooperation barrier into a strategic advantage by sharing resources to improve engineering support of Intel\´s global manufacturing operation. The concept capitalizes on e-manufacturing concepts and Intel\´s "copy exactly methodology", which ensure that factories have virtually identical infrastructure. Downtime events that require engineering support can be handled by engineering support from any of Intel identical factories. Downtime incidents are automatically routed to the appropriate engineer worldwide. It also gives them the ability to remotely access and control tools from other factories. This technology allows virtually any issue that requires engineering support to be solved remotely. Typically, to reduce the potential downtime impact, downtime events are handled by engineers on-call. The concept is being expanded into many different engineering functions and among additional factories to further increase the hours of on-site engineering coverage. This paper describes the benefits and challenges involved with implementing this concept at Intel
  • Keywords
    DP industry; manufacturing data processing; manufacturing industries; Intel factories; copy exactly methodology; downtime reduction; e-manufacturing; global factory; global operation; Automatic control; Cultural differences; Hardware; Manufacturing; Production facilities; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7392-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2000.993607
  • Filename
    993607