• DocumentCode
    2386054
  • Title

    Realizing dynamic manufacturing service provisioning mechanism in order commitment service

  • Author

    Chang, Shi-Chung ; Guo, Ruey-Shan ; Su, Yea-Huey ; Lai, Yi-Chang

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    In this paper a dynamic manufacturing service provisioning mechanism (DMSPM) is designed to flexibly create and execute manufacturing services under a virtual fab (VF) enabling framework The DMSPM exploits object-oriented (OO) technology to flexibly bind fab objects into services. It consists of four skeleton steps: name mapping, business process binding, resource reservation binding, and service management binding. To assess the feasibility and potential of DMSPM, the order commitment service (OCS) provided by a foundry serves as a study case. A prototype system is designed and implemented to realize DMSPM in the OCS application. The implementation demonstrated that current OO technology, CASE tools, Jab information infrastructure and data/information availability make DMSPM readily realizable and that DMSPM has a good potential for application to virtual Jab and e-business developments
  • Keywords
    electronic engineering computing; integrated circuit manufacture; management science; CASE tools; DMSPM; business process binding; data/information availability; dynamic manufacturing service provisioning mechanism; e-business developments; fab information infrastructure; fab objects; manufacturing services; name mapping; object oriented technology; order commitment service; resource reservation; resource reservation binding; service management binding; skeleton steps; virtual fab enabling framework; Computer aided software engineering; Flexible manufacturing systems; Foundries; Information technology; Manufacturing processes; Prototypes; Pulp manufacturing; Resource management; Semiconductor device manufacture; Skeleton;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
  • Conference_Location
    Tokyo
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7392-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2000.993609
  • Filename
    993609