DocumentCode
2386094
Title
New identification system for individual wafer management
Author
Suzuki, Eiko ; Matsuda, Hidemitsu ; Chiba, Teiichirou ; Mori, Akira
Author_Institution
NEC, Kanagawa, Japan
fYear
2000
fDate
2000
Firstpage
33
Lastpage
36
Abstract
A conventional identification (ID) has many illegible parts; ID recognition is difficult in approximately 20% of all processes. In contrast, new IDs in the V-shaped notch were clearly recognized up to the final process. The results can be explained in terms of marking dot topography and choice of the marking location. First, for marking the beveled part in a V-shaped notch on a wafer, known as finer marking, the influence of any semiconductor processes in which a conventional ID on the surface has only limited readability is kept to a minimum. Second, a marking dot formed by conventional laser marking has a central depression due to the process of general heat distribution. In contrast, a marking dot formed by finer marking has a central peak protruding from the surface, which is more easily distinguished than a dot which has a central depression. A difference in contrast has a great influence on readability for identification in semiconductor processes.
Keywords
VLSI; identification; integrated circuit manufacture; laser beam applications; ID recognition; V-shaped notch; VLSI; beveled part; finer marking; general heat distribution; identification system; individual wafer management; laser marking; marking dot topography; marking location; readability; semiconductor processes; Intrusion detection; Mass production; National electric code; Read only memory; Semiconductor films; Semiconductor materials; Shape; Surface topography; Very large scale integration; Weight control;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7392-8
Type
conf
DOI
10.1109/ISSM.2000.993611
Filename
993611
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