Title :
The world´s first 300 mm fab at Infineon - challenges and success
Author_Institution :
SEMICONDUCTOR300, GmbH & CoKG, Dresden, Germany
Abstract :
Today the semiconductor industry is beginning the transition to the next generation of manufacturing technology based on 300 mm. Infineon has paved the way in cooperation with partners and consortia to establish a base for the future. Driving factors of the wafer size conversion like standardization and establishing of joint ventures as well conversion concepts are discussed. The results of SEMICONDUCTOR300 allowed the move to the world´s first 300 mm DRAM manufacturing line. The success of this project in itself creates a number of future business opportunities for small and mid-size companies in equipment, material and the support area in this industry upturn.
Keywords :
DRAM chips; integrated circuit manufacture; 300 mm; DRAM manufacturing line; Infineon; SEMICONDUCTOR300; conversion concepts; manufacturing technology; semiconductor industry; standardization; wafer size conversion; Computer aided manufacturing; Costs; Delay; Electronics industry; International collaboration; Manufacturing industries; Productivity; Semiconductor device manufacture; Semiconductor materials; Standardization;
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Print_ISBN :
0-7803-7392-8
DOI :
10.1109/ISSM.2000.993612
