DocumentCode
2386127
Title
A new fab concept in the 300 mm wafer era
Author
Koike, Atsuyoshi
Author_Institution
Trecenti Technol. Inc., Ibaraki, Japan
fYear
2000
fDate
2000
Firstpage
44
Lastpage
47
Abstract
Trecenti Technologies, Inc. is currently creating the first 300 mm-wafer volume production fab. Our basic objectives are to minimize cycle time with all single-wafer processes and to create a scalable fab that has an optimized expansion unit to satisfy high investment efficiency and flexibility to changing market needs.
Keywords
VLSI; integrated circuit manufacture; 300 mm; 300 mm wafer; Trecenti Technologies; cycle time; high investment efficiency; market flexibility; optimized expansion unit; scalable fab; semiconductor industry; single-wafer processes; system-on-a-chip; wafer manufacturing; wafer volume production fab; Cost function; Demand forecasting; Electronics industry; Investments; Large-scale systems; Manufacturing; Optimized production technology; Product development; System-on-a-chip; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7392-8
Type
conf
DOI
10.1109/ISSM.2000.993613
Filename
993613
Link To Document