TSDC measurements of underfill encapsulant used in microelectronic packaging

Author

Cheng, K.C. ; Peng, Z. ; Wong, C.S. ; Chan, H.L.W.

Author_Institution

Dept. of Appl. Phys., Hong Kong Polytech. Univ., China

fYear

2002

fDate

2002

Firstpage

71

Lastpage

74

Abstract

The thermal stimulated depolarization current (TSDC) technique was used to study the dielectric relaxation of underfill encapsulant used in microelectronic packaging. The dependence of electrical properties of the underfill on the polarizing temperature, polarizing field and heating rate were analyzed from the TSDC spectra as a function of temperature. A single α-relaxation peak associated with the glass transition temperature T_g of the underfill was observed. A value of Tg can be estimated which can be compared to the T_g determined by differential scanning calorimetry (DSC). The activation energy and relaxation time of the dielectric relaxation of the underfill were determined from the TSDC measurements.

Keywords

dielectric relaxation; differential scanning calorimetry; encapsulation; glass transition; integrated circuit packaging; polymers; thermally stimulated currents; 90 C; DSC; TSDC measurements; TSDC spectra; TSDC technique; activation energy; dielectric relaxation; differential scanning calorimetry; electrical properties; glass transition temperature; heating rate; microelectronic packaging; polarizing field; polarizing temperature; relaxation time; thermal stimulated depolarization current; underfill encapsulant; underfill epoxy; Calorimetry; Dielectric measurements; Energy measurement; Glass; Microelectronics; Packaging; Polarization; Resistance heating; Temperature dependence; Time measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrets, 2002. ISE 11. Proceedings. 11th International Symposium on

Print_ISBN

0-7803-7560-2

Type

conf

DOI

10.1109/ISE.2002.1042946

Filename

1042946