Title :
Process Technology - Interconnects and 3D IC´s
Keywords :
Bonding; Dielectrics; MIM capacitors; Mechanical factors; National electric code; Paper technology; Parasitic capacitance; Plasma devices; Plasma properties; Three-dimensional integrated circuits;
Conference_Titel :
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-4244-0439-8
Electronic_ISBN :
1-4244-0439-8
DOI :
10.1109/IEDM.2006.346780
