Title :
A novel compact ECD tool for ULSI Cu metallization
Author :
Tsujimura, Manabu ; Mishima, Koji ; Kunisawa, Junji ; Makino, Natsuki ; Matsuda, Tetsuo ; Kaneko, Hisashi ; Okumura, Katsuya
Author_Institution :
Ebara Corp., Tokyo, Japan
Abstract :
A novel compact ECD (Electro chemical Deposition) tool was designed and developed for Cu multi-level interconnection. The design enables the entire plating process (i.e., pre-processing, electro-chemical deposition, cleaning, and drying processed wafers) to be performed using a single module, by which means optimum Raw Process Time, good uptime and low COO can be achieved The merit of the unique design using a porous ceramic presented here are non-uniformity improvement, edge profile control, and black-film protection
Keywords :
ULSI; copper; electrodeposition; integrated circuit interconnections; integrated circuit metallisation; surface cleaning; Cu; ULSI Cu metallization; black-film protection; cleaning; compact ECD tool; drying processed wafers; edge profile control; electro-chemical deposition; good uptime; optimum raw process time; plating process; pre-processing; Anodes; Ceramics; Chemicals; Cleaning; Copper; Costs; Magnetic heads; Metallization; Seals; Ultra large scale integration;
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7803-7392-8
DOI :
10.1109/ISSM.2000.993627
