A novel compact ECD tool for ULSI Cu metallization

Author

Tsujimura, Manabu ; Mishima, Koji ; Kunisawa, Junji ; Makino, Natsuki ; Matsuda, Tetsuo ; Kaneko, Hisashi ; Okumura, Katsuya

Author_Institution

Ebara Corp., Tokyo, Japan

fYear

2000

fDate

2000

Firstpage

106

Lastpage

109

Abstract

A novel compact ECD (Electro chemical Deposition) tool was designed and developed for Cu multi-level interconnection. The design enables the entire plating process (i.e., pre-processing, electro-chemical deposition, cleaning, and drying processed wafers) to be performed using a single module, by which means optimum Raw Process Time, good uptime and low COO can be achieved The merit of the unique design using a porous ceramic presented here are non-uniformity improvement, edge profile control, and black-film protection

Keywords

ULSI; copper; electrodeposition; integrated circuit interconnections; integrated circuit metallisation; surface cleaning; Cu; ULSI Cu metallization; black-film protection; cleaning; compact ECD tool; drying processed wafers; edge profile control; electro-chemical deposition; good uptime; optimum raw process time; plating process; pre-processing; Anodes; Ceramics; Chemicals; Cleaning; Copper; Costs; Magnetic heads; Metallization; Seals; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on

Conference_Location

Tokyo

ISSN

1523-553X

Print_ISBN

0-7803-7392-8

Type

conf

DOI

10.1109/ISSM.2000.993627

Filename

993627