DocumentCode
2386470
Title
Nanoscale Si-based 3-dimensional MOSFETs
Author
Park, Donggun ; Kim, Dong-Won ; Ryu, Byung-Il
Author_Institution
Semicond. R&D Center, Samsung Electron. Co., Yongin
fYear
0
fDate
0-0 0
Firstpage
1
Lastpage
4
Abstract
The authors introduce nanoscale CMOS transistors based on silicon technology to overcome the scaling limits such as area, physics, lithography, etc. For the scaling of planar transistors down to 50 nm, RCAT, PiFET, and twin SONOS memory cell transistors are developed. As the further scaling is required below 50 nm, 3 dimensional transistors such as FinFET, McFET, MBCFET, and TSNWFET are newly developed to overcome the physical scaling limits down to 10 nm with manufacturability and reliability
Keywords
CMOS memory circuits; MOSFET; circuit reliability; 3D MOSFET; 3D transistors; FinFET; MBCFET; McFET; PiFET; RCAT; Si; Si-based MOSFET; TSNWFET; memory cell transistors; nanoscale CMOS transistors; nanoscale MOSFET; planar transistors; reliability; silicon technology; twin SONOS; CMOS technology; FETs; FinFETs; Flash memory; MOSFETs; Nonvolatile memory; Random access memory; SONOS devices; Shape; Silicon on insulator technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference on
Conference_Location
Padova
Print_ISBN
1-4244-0097-X
Type
conf
DOI
10.1109/ICICDT.2006.220798
Filename
1669385
Link To Document