• DocumentCode
    2386470
  • Title

    Nanoscale Si-based 3-dimensional MOSFETs

  • Author

    Park, Donggun ; Kim, Dong-Won ; Ryu, Byung-Il

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co., Yongin
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The authors introduce nanoscale CMOS transistors based on silicon technology to overcome the scaling limits such as area, physics, lithography, etc. For the scaling of planar transistors down to 50 nm, RCAT, PiFET, and twin SONOS memory cell transistors are developed. As the further scaling is required below 50 nm, 3 dimensional transistors such as FinFET, McFET, MBCFET, and TSNWFET are newly developed to overcome the physical scaling limits down to 10 nm with manufacturability and reliability
  • Keywords
    CMOS memory circuits; MOSFET; circuit reliability; 3D MOSFET; 3D transistors; FinFET; MBCFET; McFET; PiFET; RCAT; Si; Si-based MOSFET; TSNWFET; memory cell transistors; nanoscale CMOS transistors; nanoscale MOSFET; planar transistors; reliability; silicon technology; twin SONOS; CMOS technology; FETs; FinFETs; Flash memory; MOSFETs; Nonvolatile memory; Random access memory; SONOS devices; Shape; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference on
  • Conference_Location
    Padova
  • Print_ISBN
    1-4244-0097-X
  • Type

    conf

  • DOI
    10.1109/ICICDT.2006.220798
  • Filename
    1669385