Title :
Process module control for low-κ dielectrics [CVD]
Author :
Hayzelden, C. ; Ygartua, C. ; Casavant, T. ; Slessor, M. ; Srivatsa, A. ; Guevremont, M. ; Stevens, P. ; Young, M. ; Lu, T. ; Zhang, R. ; Treadwell, C. ; Soltz, D. ; Lauber, J. ; Krumbuegel, M. ; Fiordalice, R. ; Lange, S. ; Marella, P. ; Ashkenaz, S. ; M
Author_Institution :
KLA-Tencor Corporation, San Jose, CA, USA
Abstract :
A process control system is composed of a variety of elements, from measurement technologies and techniques, through sampling strategies and analysis algorithms, to data-driven action plans. All components are required to ensure a stable process, however, effective control is founded upon a set of easily measured, yield-relevant parameters. In this work, we describe the use of a toolset and methodology to provide such parameters, and explore sampling and analysis components for the evaluation, development, and control of low-κ dielectric processes. In comparison to historically-employed interline dielectric (ILD) materials such as SiO2, these low-κ materials and processes present significant integration, reliability, and stability concerns. A particularly sensitive parameter is the dielectric constant itself. Damage from high-power ultraviolet inspection techniques may also present challenges. As these relatively immature processes migrate into volume production, these same tools and parameters can be used to monitor the low-κ process module, improve baseline yield, and control excursions.
Keywords :
chemical vapour deposition; dielectric thin films; permittivity; process control; reliability; CVD; analysis algorithms; baseline yield; data-driven action plans; dielectric constant; high-power ultraviolet inspection techniques; integration; low-κ dielectrics; measurement technologies; process control system; process module control; reliability; sampling strategies; stability; toolset; volume production; yield-relevant parameters; Algorithm design and analysis; Data analysis; Dielectric constant; Dielectric materials; Dielectric measurements; Inspection; Materials reliability; Process control; Sampling methods; Stability;
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Print_ISBN :
0-7803-7392-8
DOI :
10.1109/ISSM.2000.993630