Title : 
Gas diffusion expansion-increased thickness and enhanced electromechanical response of cellular polymer electret films
         
        
            Author : 
Paajanen, M. ; Minkkinen, H. ; Raukola, J.
         
        
            Author_Institution : 
VTT Processes, Tampere, Finland
         
        
        
        
        
        
            Abstract : 
With a high-pressure gas treatment it is possible to force extra gas inside a cellular polymer film structure, expand the film and thus reduce the film stiffness. A permanent increase in the film thickness can be in the range of 100% when using ambient temperature of about 90°C and gas pressure of about 20 bar during an 8-min long gas expansion process. High-pressure treatment at lower temperatures will increase the elastic nature of the film expansion and thus decrease the permanent increase in the film thickness. The results show that a clear increase in the electromechanical response up to 480 or 330 pCN-1 was achieved with 45 or 60 μm thick polypropylene sample films, respectively. The corresponding gas contents were 48 and 39%, respectively.
         
        
            Keywords : 
dielectric thin films; diffusion; elasticity; electrets; electromechanical effects; high-pressure techniques; polymer films; porous materials; 20 bar; 45 micron; 60 micron; 90 degC; cellular polymer electret films; electromechanical response enhancement; film elasticity enhancement; film stiffness reduction; gas diffusion expansion-increased thickness; high-pressure gas treatment; high-pressure treatment; permanent film thickness increase; polypropylene films; Biological materials; Corona; Dielectrics and electrical insulation; Electrets; Minerals; Nitrogen; Plastic insulation; Polymer films; Polymer foams; Temperature distribution;
         
        
        
        
            Conference_Titel : 
Electrets, 2002. ISE 11. Proceedings. 11th International Symposium on
         
        
            Print_ISBN : 
0-7803-7560-2
         
        
        
            DOI : 
10.1109/ISE.2002.1042976