DocumentCode :
2386825
Title :
Critical area based yield modeling on an advanced microprocessor design
Author :
Segal, Julie ; Parker, Susan ; Bakarian, Sergei ; Pak, James
Author_Institution :
HPL Inc., San Jose, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
191
Lastpage :
194
Abstract :
Critical area analysis was performed on a complex microprocessor design. (>1 Gbyte GDS file). The following applications of critical area analysis are demonstrated: yield partitioning by process layer, yield partitioning by layout block, and design for manufacturability. Advanced features such as netlist extraction, layer shift operation, and geometric expansion compared to Monte Carlo critical area extraction are discussed
Keywords :
design for manufacture; integrated circuit design; integrated circuit modelling; integrated circuit yield; integrated memory circuits; microprocessor chips; 1 Gbyte; Monte Carlo critical area extraction; advanced microprocessor design; critical area analysis; critical area based yield modeling; defect related yield loss; design for manufacturability; geometric expansion; layer shift operation; layout block; netlist extraction; process layer; yield partitioning; Bridges; Conductors; Logic arrays; Manufacturing processes; Microprocessors; Monte Carlo methods; Performance analysis; Predictive models; Solid modeling; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Conference_Location :
Tokyo
ISSN :
1523-553X
Print_ISBN :
0-7803-7392-8
Type :
conf
DOI :
10.1109/ISSM.2000.993646
Filename :
993646
Link To Document :
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