Title :
Physical Design Automation Challenges for 3D ICs
Author :
Sapatnekar, Sachin S.
Author_Institution :
Dept. of ECE, Minnesota Univ., Minneapolis, MN
Abstract :
Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm requires a major change in design methodologies, and an optimal 3D design looks very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of 3D-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits
Keywords :
electronic design automation; integrated circuit design; integrated circuit technology; 3D integrated circuit; optimal 3D design; physical design automation; process technology; Cooling; Delay; Design automation; Design methodology; Heat sinks; Integrated circuit interconnections; Power system reliability; Resistance heating; Routing; Three-dimensional integrated circuits;
Conference_Titel :
Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference on
Conference_Location :
Padova
Print_ISBN :
1-4244-0097-X
DOI :
10.1109/ICICDT.2006.220820
