Yield analysis and improvement by reducing manufacturing fluctuation noise

Author

Tsuda, Hidetaka ; Shirai, Hidehiro ; Takagi, Osamu ; Take, Riichiro

Author_Institution

CIM Div., Fujitsu LSI Technol. Ltd., Kawasaki, Japan

fYear

2000

fDate

2000

Firstpage

249

Lastpage

252

Abstract

There are various types of failures and their causes intertwined one another complicatedly. Therefore, we need to recognize timely what any kind of failure causes affect to total yield quantitatively to decide the countermeasures for yield improvement. Collected data for data analysis involve the noise with various influences. For example, analyzing all collected data always does not bring us precious correlation between the collected data. We prefer to adapt a new method to get more precious information. We have got many success stories for yield improvement by data mining which is one of the statistical methods, now we have succeeded in developing a method to clarify the correlation between yield and various wafer parametrical data value, because the data can be extracted to reduce the influence of the manufacturing fluctuation automatically.

Keywords

data analysis; data mining; failure analysis; fluctuations; integrated circuit manufacture; integrated circuit measurement; integrated circuit noise; integrated circuit reliability; integrated circuit testing; integrated circuit yield; countermeasures; data analysis; data mining; failures; manufacturing fluctuation noise reduction; wafer parametrical data value; yield analysis; yield improvement; Computer integrated manufacturing; Data analysis; Data mining; Failure analysis; Fluctuations; Large scale integration; Noise reduction; Scattering; Semiconductor device noise; Statistical analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on

ISSN

1523-553X

Print_ISBN

0-7803-7392-8

Type

conf

DOI

10.1109/ISSM.2000.993660

Filename

993660