DocumentCode
2387219
Title
Energy saving in semiconductor fabs by out-air handling unit performance improvement
Author
Suzuki, Hirokazu ; Hanaoka, Hideo ; Ohkubo, Yoshinori ; Yamazaki, Yoshio ; Shirai, Yasuyuki ; Ohmi, Tadahiro
Author_Institution
Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
fYear
2000
fDate
2000
Firstpage
293
Lastpage
296
Abstract
We shows methods of energy saving. The energy consumed in semiconductor fabs is classified into two categories, the manufacturing system and the air conditioning. The energy for the air conditioning is further classified into fresh air intake, recirculation (clean room) air conditioning and cooling system of the manufacturing system. The moisture in the fresh air is condensed on a heat exchange-fin of the air-handling unit (AHU). This condensation decreases thermal exchange and increases intake-air resistance and removal of it improves the performance. So we removed it, and 24% improvement of coefficient of heat exchange is achieved. Using this result, a 5% energy saving of the refrigerator is obtained. If the result is applied to all of the heating, ventilation, and air conditioning (HVAC) system, 3% energy saving is obtained
Keywords
HVAC; air conditioning; condensation; heat exchangers; air conditioning; air-handling unit; condensation; energy saving; heat exchange coefficient; intake-air resistance; manufacturing system; out-air handling unit performance improvement; semiconductor fabs; thermal exchange; Air conditioning; Aluminum; Coolants; Cooling; Copper; Manufacturing systems; Power engineering and energy; Refrigeration; Thermal conductivity; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2000. Proceedings of ISSM 2000. The Ninth International Symposium on
Conference_Location
Tokyo
ISSN
1523-553X
Print_ISBN
0-7803-7392-8
Type
conf
DOI
10.1109/ISSM.2000.993671
Filename
993671
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