DocumentCode :
2387293
Title :
Implementation of integratable PDMS-based conformable microelectrode arrays using a multilayer wiring interconnect technology
Author :
Guo, Liang ; DeWeerth, Stephen P.
Author_Institution :
Dept. of Biomed. Eng., Emory Univ., Atlanta, GA, USA
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
1619
Lastpage :
1622
Abstract :
To meet the emerging demand of high-throughput intimate interfaces in neuroscience research and neural prosthetics, a multilayer wiring interconnect technology for implementing high-density, integratable polydimethylsiloxane (PDMS) based conformable microelectrode arrays (MEAs) is developed. This technology has two parts: first, multilayer interconnects are fabricated within PDMS, which provides the potential for implementing high-density, large-capacity PDMS-based MEAs; second, interconnects are fabricated between PDMS and a substrate material, e.g., glass or silicon, which provides the potential for directly integrating PDMS-based MEAs with silicon-based ICs to achieve an integrated system solution for neural interfacing. Preliminary muscle surface recording experiments using a connector-integrated MEA have successfully demonstrated multichannel recording capability with good device conformability to the muscle surface during contraction. Important and promising applications will be found in neural prostheses, functional electrical stimulation (FES), and basic electrophysiology research.
Keywords :
bioelectric phenomena; biomedical electrodes; biomedical electronics; interconnections; microelectrodes; multilayers; muscle; neurophysiology; polymers; prosthetics; silicon; electrophysiology; functional electrical stimulation; integratable PDMS-based conformable microelectrode arrays; multichannel recording; multilayer wiring interconnect technology; muscle contraction; muscle surface recording; neural interfacing; neural prosthetics; polydimethylsiloxane; silicon-based IC; Dimethylpolysiloxanes; Microelectrodes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5333218
Filename :
5333218
Link To Document :
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