• DocumentCode
    2387317
  • Title

    Volumetric description of dip solder joints from range data

  • Author

    Takagi, Yuji ; Medioni, Gerard

  • Author_Institution
    Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
  • fYear
    1998
  • fDate
    19-21 Oct 1998
  • Firstpage
    146
  • Lastpage
    151
  • Abstract
    Dip solder joints exhibit a variety of complex shapes, making inspection by traditional representation methods difficult. Traditional approaches use various features of 2D images to represent joint shape; however, correct 3-D representation is essential when analyzing joint shape for visual inspection. We present a method of using generalized cylinders (GCs) to obtain a 3-D representation of a solder joint from the joint´s range image. This method is based on symmetry detection. B-spline contour representation allows analytical detection of a symmetry axis that is used as a basis for the GC axis. In addition, we present a B-spline fitting method that uses an initial line fitting procedure. The contour of the cross section is expressed as an ellipse using an ellipse-specified conic fitting method. Correct representations for over 53 test sample range images were obtained
  • Keywords
    computer vision; inspection; soldering; splines (mathematics); 2D images; 3-D representation; B-spline contour representation; B-spline fitting method; dip solder joints; generalized cylinders; inspection; range data; volumetric description; Electronics packaging; Flowcharts; Image analysis; Inspection; Lead; Production engineering; Shape; Soldering; Spline; Surface fitting;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Computer Vision, 1998. WACV '98. Proceedings., Fourth IEEE Workshop on
  • Conference_Location
    Princeton, NJ
  • Print_ISBN
    0-8186-8606-5
  • Type

    conf

  • DOI
    10.1109/ACV.1998.732872
  • Filename
    732872