• DocumentCode
    2387412
  • Title

    Stretchable tracks for laser-machined neural electrode arrays

  • Author

    Schuettler, Martin ; Pfau, Damir ; Ordonez, Juan S. ; Henle, Christian ; Woias, Peter ; Stieglitz, Thomas

  • Author_Institution
    Dept. of Microsyst. Eng. - IMTEK, Univ. of Freiburg, Freiburg, Germany
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    1612
  • Lastpage
    1615
  • Abstract
    An easy and fast method for fabrication of neural electrode arrays is the patterning of platinum foil and spin-on silicone rubber using a laser. However, the mechanical flexibility of such electrode arrays is limited by the integrated tracks that connect the actual electrode sites and the contacts to which wires are welded. Changing the design from straight lines to meanders, the tracks can be stretched to a certain extend defined by the shape of the meanders. Horse-shoe-like designs described by an opening angle thetas = 3D 60deg and ratio between curvature radius r and track width w of r/w = 3D 3.6 permitted stretching of 14.4% before track breakage. For r/w = 3D 11.7 a maximum elongation at break of 19.7% was measured. Larger opening angles thetas provided even better flexibility but with increasing thetas, the tensile strength and the electrical conductance of a single track is compromised and the maximum integration density (tracks per area) decreases.
  • Keywords
    bioelectric phenomena; biomedical electrodes; brain; foils; laser beam machining; neurophysiology; platinum; silicone rubber; tensile strength; Pt; electrical conductance; electro-corticogram recording; electrode array mechanical flexibility; electrode sites; horse-shoe-like design; integrated stretchable tracks; laser-machined neural electrode arrays fabrication; maximum integration density; platinum foil patterning; spin-on silicone rubber; tensile strength; Electrodes; Lasers; Neural Networks (Computer);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5333224
  • Filename
    5333224