Title :
Wireless Integrated Microsystems: Coming Breakthroughs in Health Care
Author :
Wise, Kensall D.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI
Abstract :
Wireless integrated microsystems, merging micropower circuits, wireless interfaces, hermetic wafer-level packaging, and MEMS are poised to provide breakthroughs in health care. While cochlear microsystems have restored functional hearing to the deaf and deep brain stimulation is remarkably successful in suppressing Parkinson´s tremor, retinal implants for the blind, cortical prostheses for paralysis, and other devices are also emerging, along with systems that could revolutionize our understanding of the brain. The tissue interface, device/circuit challenges, and packaging are examined along with future needs
Keywords :
micromechanical devices; prosthetics; wafer level packaging; MEMS; Parkinson tremor; cochlear microsystems; cortical prostheses; deep brain stimulation; health care; micropower circuits; retinal implants; wafer-level packaging; wireless integrated microsystems; wireless interfaces; Auditory implants; Auditory system; Brain stimulation; Circuits; Deafness; Medical services; Merging; Micromechanical devices; Retina; Wafer scale integration;
Conference_Titel :
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location :
San Francisco, CA
Print_ISBN :
1-4244-0439-8
Electronic_ISBN :
1-4244-0439-8
DOI :
10.1109/IEDM.2006.346833
