DocumentCode :
2387622
Title :
Modeling and Simulation of Fluorine Related Diffusion in Silicon
Author :
Zhang, Jinyu ; Ashizawa, Yoshio ; Oka, Hideki
Author_Institution :
Fujitsu R&D Center Co., Ltd.
fYear :
0
fDate :
0-0 0
Firstpage :
50
Lastpage :
53
Abstract :
Fluorine related diffusion has drawn extensive attention recently, for experiments revealed that co-implanted F in Si can reduce transient enhanced diffusion (TED) of boron. However, disagreement still exists on whether this effect is caused by interaction of F with point defects or that with boron atoms. Also, some unusual F diffusion behaviors are still not thoroughly understood. We attempt to establish a universal model to explain the F related diffusion. In this paper, we will present our first-principles study on F related structures. Based on results of theoretical study, we established a continuum model to simulate F related diffusion extensively, including F diffusion during solid phase epitaxy (SPE) process, F diffusion at low and high concentration levels, and boron TED suppression caused by co-doping with F. The simulation results are in good agreement with the experiments supporting different mechanisms of F related diffusion
Keywords :
ab initio calculations; boron; diffusion; doping profiles; elemental semiconductors; fluorine; impurity-defect interactions; interstitials; ion implantation; semiconductor doping; silicon; solid phase epitaxial growth; vacancies (crystal); Si:B,F; ab initio calculations; boron codoping; codoping; coimplantation; continuum model; diffusion; first-principles method; fluorine doping; fluorine-point defects interaction; interstitial; solid phase epitaxy; transient enhanced diffusion; vacancy; Amorphous silicon; Boron; Crystallization; Epitaxial growth; Equations; Laboratories; Numerical simulation; Research and development; Semiconductor process modeling; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2006. IWJT '06. International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0047-3
Type :
conf
DOI :
10.1109/IWJT.2006.220859
Filename :
1669446
Link To Document :
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