DocumentCode
2387729
Title
Floating Body Cell with Independently-Controlled Double Gates for High Density Memory
Author
Ban, Ibrahim ; Avci, Uygar E. ; Shah, Uday ; Barns, Chris E. ; Kencke, David L. ; Chang, Peter
Author_Institution
Technol. Manuf. Group, Intel Corp., Hillsboro, OR
fYear
2006
fDate
11-13 Dec. 2006
Firstpage
1
Lastpage
4
Abstract
An aggressively scaled, self-aligned, independently controlled double-gate floating body cell (IDG FBC) is reported. This structure eases the scaling constraints of other FBC memory devices proposed to date. Enhanced memory performance has been demonstrated owing to the independent back gate with thin oxide and thin Si fin. Memory devices with 85-nm Lg and 30-nm fin widths (Z) have been shown to exhibit better memory characteristics at a lower voltage than alternative FBC structures at comparable dimensions. Design, fabrication, operation, and scalability of IDG FBC devices are discussed
Keywords
DRAM chips; nanoelectronics; silicon-on-insulator; 30 nm; 85 nm; DRAM chips; floating body cell; high density memory; silicon-on-insulator; Doping; Fabrication; Low voltage; Manufacturing processes; Potential well; Random access memory; Resource description framework; Scalability; Threshold voltage; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location
San Francisco, CA
Print_ISBN
1-4244-0439-8
Electronic_ISBN
1-4244-0439-8
Type
conf
DOI
10.1109/IEDM.2006.346847
Filename
4154266
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