• DocumentCode
    2387729
  • Title

    Floating Body Cell with Independently-Controlled Double Gates for High Density Memory

  • Author

    Ban, Ibrahim ; Avci, Uygar E. ; Shah, Uday ; Barns, Chris E. ; Kencke, David L. ; Chang, Peter

  • Author_Institution
    Technol. Manuf. Group, Intel Corp., Hillsboro, OR
  • fYear
    2006
  • fDate
    11-13 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    An aggressively scaled, self-aligned, independently controlled double-gate floating body cell (IDG FBC) is reported. This structure eases the scaling constraints of other FBC memory devices proposed to date. Enhanced memory performance has been demonstrated owing to the independent back gate with thin oxide and thin Si fin. Memory devices with 85-nm Lg and 30-nm fin widths (Z) have been shown to exhibit better memory characteristics at a lower voltage than alternative FBC structures at comparable dimensions. Design, fabrication, operation, and scalability of IDG FBC devices are discussed
  • Keywords
    DRAM chips; nanoelectronics; silicon-on-insulator; 30 nm; 85 nm; DRAM chips; floating body cell; high density memory; silicon-on-insulator; Doping; Fabrication; Low voltage; Manufacturing processes; Potential well; Random access memory; Resource description framework; Scalability; Threshold voltage; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2006. IEDM '06. International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    1-4244-0439-8
  • Electronic_ISBN
    1-4244-0439-8
  • Type

    conf

  • DOI
    10.1109/IEDM.2006.346847
  • Filename
    4154266