• DocumentCode
    2387953
  • Title

    Fabrication of a PMMA Torsional Micromirror Device Based on Hot Embossing Process

  • Author

    Amaya, S. ; Dao, Dzung Viet ; Sugiyama, Susumu

  • Author_Institution
    TOWA Corp., Kyoto
  • fYear
    2008
  • fDate
    6-9 Nov. 2008
  • Firstpage
    7
  • Lastpage
    11
  • Abstract
    This paper reports the fabrication of a PMMA torsional micromirror device using hot embossing and ultra-precision machining. The mirror is operated based on electrostatic vertical comb-drive actuators. The fabrication process is described as followings. First, two-stepped silicon mold is fabricated from silicon wafer by photolithography and ICP-RIE. Next, the micromirror device structures are formed on PMMA by hot embossing method. The comb-drive actuator has finger width and gap between fingers are both 5 um, and device thickness is about 60 um. The PMMA layer that remained after hot embossing is removed by ultra-precision cutting method to release the movable parts. The maximum surface roughness of the mirror after released by ultra-precision cutting is 87 nm (Rz). Finally, the device is coated with a gold layer to create the electrical conductivity for comb finger of the actuator. PMMA torsional micromirror comb-drive actuator has been fabricated, and the device was tested successfully.
  • Keywords
    cutting; machining; micromirrors; photolithography; surface roughness; ICP-RIE; PMMA torsional micromirror comb-drive actuator; PMMA torsional micromirror device fabrication; electrostatic vertical comb-drive actuators; hot embossing process; maximum surface roughness; photolithography fabrication; silicon wafer; two-stepped silicon mold; ultra-precision cutting method; ultra-precision machining; Electrostatic actuators; Embossing; Fabrication; Fingers; Lithography; Machining; Micromirrors; Mirrors; Rough surfaces; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro-NanoMechatronics and Human Science, 2008. MHS 2008. International Symposium on
  • Conference_Location
    Nagoya
  • Print_ISBN
    978-1-4244-2918-9
  • Electronic_ISBN
    978-1-4244-2919-6
  • Type

    conf

  • DOI
    10.1109/MHS.2008.4752413
  • Filename
    4752413