Importance of Science in Silicide Technology for Nect Technology Node SoC

Silicide materials have been changed according to purposes and application conditions for more than 20 years in Si LSIs. The main purpose of using silicides is lowering the resistances of doped Si layers including poly-Si lines. Silicide material was changed from low resistivity refractory metal suicide such as TiSi₂ to near-noble metal silicides such as NiSi from the view point of less consumption of Si by silicidation. Actually, the pn junction leakage for shallow S/D can be drastically improved by NiSi as compared with disilicides. However, the thermal stability of monosilicides is required, since those monosilicides can be changed to disilicides, if disilicide phase exists in thermodynamic phase diagrams of metal-Si binary systems. In this paper, the importance of science applicable in handling NiSi skillfully in next generation SoC fabrication is discussed