• DocumentCode
    2388085
  • Title

    Self-Organized

  • Author

    Mise, N. ; Watanabe, Yoshihiro ; Migita, S. ; Nabatame, T. ; Satake, Hiroshi ; Toriumi, A.

  • Author_Institution
    MIRAI-ASET, AIST, Tsukuba
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    170
  • Lastpage
    175
  • Abstract
    Self-organized (111) faceted NiSi2 source and drain structure with segregated dopants in the NiSi2/Si interfaces has been proposed for aggressively scaled SOI MOSFETs. The advantages of this source and drain structure are a superior short-channel effect (SCE) immunity and a very small parasitic resistance. The SCE is suppressed by a trapezoidal shape of the channel and by a small variation in the channel length that is obtained thanks to the epitaxial growth of NiSi2 on Si. The significant effects of the channel shape and the variation-free channel length are also confirmed by the numerical simulation. Owing to the low-temperature annealing at 600degC for NiSi2 formation and dopants activation, wider selections of gate metal and high-k gate dielectric are possible. Moreover, NiSi2 is the most Si-rich phase among nickel silicides family and thermally stable. Self-organized (111) faceted NiSi 2 source/drain structure is thus quite promising for future CMOS devices
  • Keywords
    MOSFET; annealing; electric resistance; epitaxial growth; nickel compounds; self-assembly; silicon-on-insulator; 600 degC; CMOS devices; NiSi2-Si; SOI MOSFET; channel length; epitaxial growth; gate metal; high-k gate dielectric; low-temperature annealing; nickel silicides; parasitic resistance; segregated dopants; self-organized faceted drain; self-organized faceted source; short-channel effect; Annealing; Buildings; High K dielectric materials; MOSFETs; Nickel; Schottky barriers; Shape; Silicides; Silicon; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2006. IWJT '06. International Workshop on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0047-3
  • Type

    conf

  • DOI
    10.1109/IWJT.2006.220885
  • Filename
    1669472