DocumentCode :
2388371
Title :
Elimination of Floating body Effect and Thermal Instability in a Nano Quasi-SOI MOSFET with π-shaped Semiconductor Layer
Author :
Jyi-Tsong Lin ; Yi-Chuen Eng ; Tai-Yi Lee ; Kao-Cheng Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung
fYear :
2006
fDate :
15-16 May 2006
Firstpage :
229
Lastpage :
232
Abstract :
In this paper, a new device structure called the quasi-SOI MOSFET with pi-shaped semiconductor conductive layer is proposed and demonstrated. In this structure, the pi-shaped source/drain layer is formed by the block oxide which consists of three separate oxide islands under the source, the drain, and the body regions, respectively. In other words, due to the three separate oxide islands forming two paths from source/drain to substrate, the generated holes and heat can be eliminated from this source/drain-tied scheme, thus, the proposed quasi-SOI structure shows to improve the kink effect and the self-heating problem as compared with that of conventional SOI structures. Moreover, owing to that the block oxide is utilized to restrict the electric field built between body and source/drain region, the ultra-short-channel effect is also diminished. Besides, our structure is based on the bulk wafer, thus, the cost can be cheaper than the SOI wafer
Keywords :
MOSFET; silicon-on-insulator; floating body effect elimination; kink effect; pi-shaped semiconductor conductive layer; pi-shaped source/drain layer; quasiSOI MOSFET; quasiSOI structure; self-heating problem; thermal instability elimination; ultrashort-channel effect; Amorphous materials; Body regions; CMOS technology; Chemical vapor deposition; Etching; MOSFET circuits; Silicon on insulator technology; Substrates; Thermal conductivity; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2006. IWJT '06. International Workshop on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0047-3
Type :
conf
DOI :
10.1109/IWJT.2006.220898
Filename :
1669485
Link To Document :
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