• DocumentCode
    2389291
  • Title

    Excellent uniformity and reproducible resistance switching characteristics of doped binary metal oxides for non-volatile resistance memory applications

  • Author

    Lee, Dongsoo ; Seong, Dong-jun ; Choi, Hye jung ; Jo, Inhwa ; Dong, R. ; Xiang, W. ; Oh, Seokjoon ; Pyun, Myeongbum ; Seo, Sun-ok ; Heo, Seongho ; Jo, Minseok ; Hwang, Dae-Kyu ; Park, H.K. ; Chang, M. ; Hasan, M. ; Hwang, Hyunsang

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Gwangju Inst. of Sci. & Technol.
  • fYear
    2006
  • fDate
    11-13 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We have investigated various doped metal oxides such as copper doped molybdenum oxide, copper doped Al2O3, copper doped ZrO2, aluminium doped ZnO, and CuxO for novel resistance memory applications. Compared with non-stoichiometric oxides (Nb2O5-x, ZrOx, SrTiOx), doped metal oxides show higher device yield. Moreover, Cu:MoOx have demonstrated excellent memory characteristics such as reliability under programming cycles, potential multi-bit operation, good data retention, highly scalable property, and fast switching speed. The switching mechanism of the copper doped molybdenum oxide can be explained by the generation and rupture of multi-filaments under the electrical stress
  • Keywords
    MIS devices; aluminium; aluminium compounds; copper; molybdenum compounds; random-access storage; semiconductor device reliability; zinc compounds; zirconium compounds; Al:ZnO; Cu:Al2O3; Cu:MoO; Cu:ZrO2; CuO; doped binary metal oxides; fast switching speed; good data retention; highly scalable property; nonvolatile resistance memory applications; potential multibit operation; reliability; resistance switching characteristics; Aluminum oxide; Copper; Electric resistance; Low voltage; Magnetic analysis; Materials science and technology; Nonvolatile memory; Sputtering; Stress; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2006. IEDM '06. International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    1-4244-0438-X
  • Electronic_ISBN
    1-4244-0439-8
  • Type

    conf

  • DOI
    10.1109/IEDM.2006.346733
  • Filename
    4154334