DocumentCode
2389291
Title
Excellent uniformity and reproducible resistance switching characteristics of doped binary metal oxides for non-volatile resistance memory applications
Author
Lee, Dongsoo ; Seong, Dong-jun ; Choi, Hye jung ; Jo, Inhwa ; Dong, R. ; Xiang, W. ; Oh, Seokjoon ; Pyun, Myeongbum ; Seo, Sun-ok ; Heo, Seongho ; Jo, Minseok ; Hwang, Dae-Kyu ; Park, H.K. ; Chang, M. ; Hasan, M. ; Hwang, Hyunsang
Author_Institution
Dept. of Mater. Sci. & Eng., Gwangju Inst. of Sci. & Technol.
fYear
2006
fDate
11-13 Dec. 2006
Firstpage
1
Lastpage
4
Abstract
We have investigated various doped metal oxides such as copper doped molybdenum oxide, copper doped Al2O3, copper doped ZrO2, aluminium doped ZnO, and CuxO for novel resistance memory applications. Compared with non-stoichiometric oxides (Nb2O5-x, ZrOx, SrTiOx), doped metal oxides show higher device yield. Moreover, Cu:MoOx have demonstrated excellent memory characteristics such as reliability under programming cycles, potential multi-bit operation, good data retention, highly scalable property, and fast switching speed. The switching mechanism of the copper doped molybdenum oxide can be explained by the generation and rupture of multi-filaments under the electrical stress
Keywords
MIS devices; aluminium; aluminium compounds; copper; molybdenum compounds; random-access storage; semiconductor device reliability; zinc compounds; zirconium compounds; Al:ZnO; Cu:Al2O3; Cu:MoO; Cu:ZrO2; CuO; doped binary metal oxides; fast switching speed; good data retention; highly scalable property; nonvolatile resistance memory applications; potential multibit operation; reliability; resistance switching characteristics; Aluminum oxide; Copper; Electric resistance; Low voltage; Magnetic analysis; Materials science and technology; Nonvolatile memory; Sputtering; Stress; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location
San Francisco, CA
Print_ISBN
1-4244-0438-X
Electronic_ISBN
1-4244-0439-8
Type
conf
DOI
10.1109/IEDM.2006.346733
Filename
4154334
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