Title :
Suggestion of new X-ray mask using carbon substrate
Author :
Takahashi, Naoki ; Tsujii, Hiroshi ; Noda, Daiji ; Hattori, Tadashi
Author_Institution :
Lab. of Adv. Sci. &T echnol. for Ind., Univ. of Hyogo, Kamigori
Abstract :
The LIGA process is drawing the attention of engineers as one of the most promising technologies for fabricating nanometric/micrometric three-dimensional microstructures. It is widely recognized that in the LIGA process, the accuracy of the completed structure depends largely on the accuracy of the X-ray mask used. A resin material is conventionally used for the membrane of large X-ray masks. However, X-ray masks comprising a resin membrane have the disadvantage that, after several cycles of X-ray exposure, they crease and sag due to X-ray-derived heat. As a substitute for the conventional resin membrane, we experimentally fabricated a new X-ray mask using a carbon wafer membrane that has an extremely small thermal expansion coefficient and is easy to process. An X-ray mask having 1:1 line & space patterns at 5.3 mum intervals, with an Au absorber height of 4 mum, was fabricated on a carbon wafer substrate by applying UV lithography and electrolytic plating. The newly fabricated X-ray mask was subjected to X-ray exposure experiment using the synchrotron radiation facility New SUBARU BL-11, owned by the University of Hyogo.
Keywords :
LIGA; X-ray masks; carbon; electroplating; nanolithography; thermal expansion; ultraviolet lithography; C; LIGA process; UV lithography; X-ray mask; carbon substrate; carbon wafer membrane; electrolytic plating; membrane; nanometric/micrometric three-dimensional microstructures; resin material; small thermal expansion coefficient; synchrotron radiation; Biomembranes; Engineering drawings; Fabrication; Laboratories; Lithography; Medical services; Microstructure; Nanotechnology; Resins; Thermal expansion;
Conference_Titel :
Micro-NanoMechatronics and Human Science, 2008. MHS 2008. International Symposium on
Conference_Location :
Nagoya
Print_ISBN :
978-1-4244-2918-9
Electronic_ISBN :
978-1-4244-2919-6
DOI :
10.1109/MHS.2008.4752488