• DocumentCode
    2389427
  • Title

    Cost-efficient built-in repair analysis for embedded memories with on-chip ECC

  • Author

    Sun, Hongbin ; Zhao, Jizhong ; Wang, Fei ; Zheng, Nanning ; Zhang, Tong

  • Author_Institution
    Inst. of Artificial Intell. & Robot., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2011
  • fDate
    17-19 June 2011
  • Firstpage
    95
  • Lastpage
    100
  • Abstract
    This paper concerns low-cost implementation of built-in repair analysis (BIRA) for embedded memories. As embedded memories become more and more dominant in system-on-chip (SoC) design, it is very crucial to achieve sufficiently high embedded memory yield. Due to the increasing number of diversified embedded memories on chip, external memory testing and redundancy repair analysis become inadequate and the use of BIRA becomes more attractive and even indispensable. The essential challenge of BIRA design is to how to minimize its unnegligible implementation cost without sacrificing the achievable repair rate. The key feature that distinguishes this work from prior work is that, motivated by the fact that almost all the embedded memories use error correction code (ECC) for soft error tolerance, we propose to appropriately leverage such existing built-in error correction capability to enable very low-cost BIRA implementations while maintaining the same and even higher defect repair rate and the same soft error tolerance. With this underlying theme, this paper presents a specific design solution, and its effectiveness and advantages over existing solutions has been successfully demonstrated using computer simulations.
  • Keywords
    embedded systems; error correction codes; system-on-chip; SoC; built-in error correction; cost-efficient built-in repair analysis; embedded memories; error correction code; soft error tolerance; system-on-chip design; Arrays; Error correction; Error correction codes; Maintenance engineering; Redundancy; System-on-a-chip; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Access Spaces (ISAS), 2011 1st International Symposium on
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4577-0716-2
  • Electronic_ISBN
    978-1-4577-0715-5
  • Type

    conf

  • DOI
    10.1109/ISAS.2011.5960927
  • Filename
    5960927