• DocumentCode
    2389556
  • Title

    Scaling Behavior of In0.7Ga0.3As HEMTs for Logic

  • Author

    Kim, Dae-Hyun ; del Alamo, Jesís A.

  • Author_Institution
    Massachusetts Inst. of Technol., Cambridge, MA
  • fYear
    2006
  • fDate
    11-13 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We have experimentally investigated the impact of lateral and vertical scaling of In0.7Ga0.3As HEMTs on their logic performance. Reducing the In0.52Al0.48As insulator thickness results in much better electrostatic integrity and improved short-channel effects down to a gate length of 60 nm. Our nearly enhancement-mode 60 nm HEMTs feature VT = -0.02 V, DIBL = 93 mV/V and S = 88 mV/V. For a given value of ION/I OFF = 103, we obtain CV/I = 0.85 ps at Vcc = 0.5 V. For the same leakage current, these devices exhibit 2.5 times more current drive than state-of-the-art low-power 65 nm CMOS
  • Keywords
    III-V semiconductors; gallium arsenide; high electron mobility transistors; indium compounds; logic gates; 0.5 V; 60 nm; In0.7Ga0.3As; electrostatic integrity; enhancement mode HEMT; insulator thicknes; lateral scaling; logic gates; short-channel effects; vertical scaling; Electrostatics; HEMTs; Indium compounds; Indium gallium arsenide; Indium phosphide; Insulation; Logic devices; MODFETs; Tin; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2006. IEDM '06. International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    1-4244-0438-X
  • Electronic_ISBN
    1-4244-0439-8
  • Type

    conf

  • DOI
    10.1109/IEDM.2006.346728
  • Filename
    4154345