DocumentCode :
2389556
Title :
Scaling Behavior of In0.7Ga0.3As HEMTs for Logic
Author :
Kim, Dae-Hyun ; del Alamo, Jesís A.
Author_Institution :
Massachusetts Inst. of Technol., Cambridge, MA
fYear :
2006
fDate :
11-13 Dec. 2006
Firstpage :
1
Lastpage :
4
Abstract :
We have experimentally investigated the impact of lateral and vertical scaling of In0.7Ga0.3As HEMTs on their logic performance. Reducing the In0.52Al0.48As insulator thickness results in much better electrostatic integrity and improved short-channel effects down to a gate length of 60 nm. Our nearly enhancement-mode 60 nm HEMTs feature VT = -0.02 V, DIBL = 93 mV/V and S = 88 mV/V. For a given value of ION/I OFF = 103, we obtain CV/I = 0.85 ps at Vcc = 0.5 V. For the same leakage current, these devices exhibit 2.5 times more current drive than state-of-the-art low-power 65 nm CMOS
Keywords :
III-V semiconductors; gallium arsenide; high electron mobility transistors; indium compounds; logic gates; 0.5 V; 60 nm; In0.7Ga0.3As; electrostatic integrity; enhancement mode HEMT; insulator thicknes; lateral scaling; logic gates; short-channel effects; vertical scaling; Electrostatics; HEMTs; Indium compounds; Indium gallium arsenide; Indium phosphide; Insulation; Logic devices; MODFETs; Tin; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2006. IEDM '06. International
Conference_Location :
San Francisco, CA
Print_ISBN :
1-4244-0438-X
Electronic_ISBN :
1-4244-0439-8
Type :
conf
DOI :
10.1109/IEDM.2006.346728
Filename :
4154345
Link To Document :
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